Upgrading And Refurbishment

Systematically revamp, upgrade or refurbish the semiconductor back-end equipment in the semiconductor industry to meet the following requirements:

1. The old equipment is compatible with the manufacture of new products, saving the cost of purchasing new equipment by modifying the equipment

2. The old equipment can upgrade the hardware and install new software functions to meet higher and more process requirements or MES access requirements;

3. For the old equipment with reduced accuracy, low-efficiency, unstable , and even tend to be eliminated, most of the original performance of the equipment can be restored by refurbishing the core module, which is comparable to the original accuracy, efficiency and stability of the factory

Circuit Board/Equipment Module

Engineers with more than 10 years maintenance experience of repairing circuit board , chip level maintenance of Die-bonding and Wire-bonding in semiconductor industry, control board, driver board of the testing/sorting equipment, as well as maintenance and repair ability of equipment module components, such as flip unit module of BESI 8800FC, bond head module of 2200evo, etc.

On-site maintenance service

Maintenance engineer with more than 10 years of working experience in semiconductor packaging plant, provide on-site technical service support for Die-bonding, Wire-bonding, testing and sorting equipment in semiconductor industry, repair the fault equipment (provide emergency spare parts), and provide the timely and professional maintenance work to improve equipment stability and working efficiency.。